Welding Equipment

Multi-layer Formic Acid Vacuum Soldering Reflow Oven Reflow Oven Semiconductor Packaging Soldering System

SKU: 1600951945771
Category: Welding Equipment

The Multi-layer Formic Acid Vacuum Soldering Reflow Oven is a state-of-the-art soldering system designed for semiconductor packaging. This advanced reflow oven provides high precision and efficiency in chip soldering. With its innovative features, it ensures uniform hea...

R3,528,005

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Section:: Machinery
Category:: Welding Equipment
SKU:: 1600951945771

Sold by Afrimart Online

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21 Dec, 2026

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Product Description

Multi-layer Formic Acid Vacuum Soldering Reflow Oven

Specifications

Attribute	Details
Type	Reflow Solder
Voltage	380V
Condition	New
Brand Name	HVT
Usage	Chip soldering
Dimensions	14009002150mm
Current	380V, 3-phase five-wire
Weight	550 KG
Name	Multi-layer formic acid soldering oven
Soldering Oven Size	400*500mm
Layer	3-layers
Gas Used	Nitrogen; Formic acid
Platform Heating Speed	35-40℃ /min
Platform Cooling Speed	100-120℃/min
Temperature Evenness	≤±1%
Chamber with Watch Window	Yes
Temperature Range	Room-400℃
Packaging Details	Standard export wooden box
Selling Units	Single item
Supply Ability	10 pieces per Month

Key Features

Advanced multi-layer design for efficient soldering.
Precise temperature control within ±1% for consistent results.
Fast heating and cooling speeds to optimize production.
Utilizes nitrogen and formic acid for improved solder quality.
Compact dimensions fit well in various workspaces.

Applications

Semiconductor packaging for electronic devices.
Chip soldering in various manufacturing processes.
High-precision soldering in laboratories and production lines.
Research and development of new electronic components.
Repair and maintenance of electronic products.

Product Info Gallery

Frequently Asked Questions

What is the main purpose of the Multi-layer Formic Acid Vacuum Soldering Reflow Oven?

The main purpose of the Multi-layer Formic Acid Vacuum Soldering Reflow Oven is to provide high precision and efficiency in chip soldering, specifically for semiconductor packaging.

What are the dimensions of the reflow oven?

The dimensions of the Multi-layer Formic Acid Vacuum Soldering Reflow Oven are 1400mm x 900mm x 2150mm.

What voltage does the soldering oven operate on?

The soldering oven operates on a voltage of 380V.

What is the weight of the oven?

The Multi-layer Formic Acid Vacuum Soldering Reflow Oven weighs 550 KG.

What is the temperature range that this reflow oven can achieve?

The temperature range of the reflow oven is from room temperature to 400℃.

How many layers does the soldering oven have?

The Multi-layer Formic Acid Vacuum Soldering Reflow Oven features a 3-layer design.

What gases are used in this soldering system?

The oven utilizes nitrogen and formic acid for improved solder quality during the soldering process.

What is the cooling speed of the oven?

The platform cooling speed of the oven is between 100-120℃ per minute.

How precise is the temperature control in this reflow oven?

The temperature control in the Multi-layer Formic Acid Vacuum Soldering Reflow Oven is precise within ±1%.

What are the applications of this reflow oven?

The oven is used for semiconductor packaging, chip soldering in manufacturing processes, high-precision soldering in labs, research and development, and repair and maintenance of electronic products.

What is the heating speed of the oven?

The platform heating speed of the oven is 35-40℃ per minute.

Is the oven suitable for laboratories?

Yes, the Multi-layer Formic Acid Vacuum Soldering Reflow Oven is suitable for high-precision soldering in laboratories and production lines.

How is the oven packaged for shipping?

The oven is packaged in a standard export wooden box to ensure safe delivery.

What is the supply ability of this product?

The supply ability of the Multi-layer Formic Acid Vacuum Soldering Reflow Oven is 10 pieces per month.

Is the oven new or refurbished?

The Multi-layer Formic Acid Vacuum Soldering Reflow Oven is brand new.