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Industrial Machinery

Semiconductor Package Chip Die operation Advanced Aluminum Gold Manual-Semi-Auto Manual-Semi Wire Bonding Bonder machine

  • SKU: 11000023127888
  • Category: Industrial Machinery

The Semiconductor Package Chip Die Operation Advanced Aluminum Gold Manual-Semi-Auto Wire Bonding Bonder Machine is an innovative solution for all your bonding needs. This machine combines manual and semi-automatic features for precise and effective wire bonding. It is...

Price per item

R1,986,497.00

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Section:
Machinery
SKU:
11000023127888
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Product Description

Semiconductor Package Chip Die Operation Advanced Aluminum Gold Manual-Semi-Auto Wire Bonding Bonder Machine

The Semiconductor Package Chip Die Operation Advanced Aluminum Gold Manual-Semi-Auto Wire Bonding Bonder Machine is an innovative solution for all your bonding needs. This machine combines manual and semi-automatic features for precise and effective wire bonding. It is designed for high efficiency and reliability in semiconductor packaging.

Specifications

AttributeDetails
Brand NameMinder-hightech
Model NumberMDZW-BW1880
Weight (KG)50
Core ComponentsPLC
Warranty1 Year
Video Outgoing InspectionProvided
Machinery Test ReportProvided
Selling UnitsSingle item
PriceUS$ 270,000+

Key Features

  • Combines manual and semi-automatic operation.
  • High precision with advanced technology.
  • Robust PLC core components for reliability.
  • Comprehensive test reports and video inspection provided.
  • Lightweight design weighing only 50 KG.

Applications

  • Used in semiconductor packaging.
  • Ideal for aluminum and gold wire bonding.
  • Perfect for both manual and semi-automated production lines.
  • Suitable for various electronics manufacturing processes.
  • Effective for research and development in semiconductor technology.

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