B21, China Town Mall, Midrand
Oven High Reflow Technology Vacuum Soldering for Data Center Hardware
- Section : Machinery
- Category : Welding Equipment
- SKU : 1601184817120
Oven High Reflow Technology Vacuum Soldering for Data Center Hardware
The Oven High Reflow Technology Vacuum Soldering is designed for modern data center hardware. This advanced reflow soldering oven provides precision and efficiency. It ensures high-quality soldering for electronic components. With a robust build and reliable performance, it is perfect for your data center needs.
Specifications
| Attribute | Details |
|---|---|
| Type | Reflow Solder |
| Condition | New |
| Brand | Opto-Intel |
| Dimensions | 1470 * 1420 * 1745 cm |
| Weight | 230 KG |
| Product Name | Vacuum Solder Reflow Oven |
| Selling Units | Single item |
| Single Package Size | 1470X1420X1745 cm |
| Single Gross Weight | 230.000 KG |
Key Features
- High reflow technology for precision soldering.
- Vacuum environment reduces defects in solder joints.
- New condition ensures reliability and performance.
- Compact dimensions fit well in any workspace.
- Heavy-duty build quality for long-lasting use.
Applications
- Soldering components in data center hardware.
- Manufacturing electronic devices.
- Repairing and maintaining circuit boards.
- Prototyping new electronic products.
- Quality control in production lines.
Product Info Gallery
- Shipping Timeframes: All orders are processed within 2-5 business days (excluding weekends and holidays). After your order has been processed, the estimated delivery time is before 03 Feb, 2026, depending on customs, Please note that due to high demand, some items may experience longer shipping times, which will be communicated at order confirmation email.
- Order Processing Time: Please allow 2-5 business days for us to process your order before it is shipped . Orders placed after 16:00 on Fridays, or during weekends and public holidays, will begin processing on the next business day. Processing times may be extended during peak seasons or sales events.
- Manufacturing Time: Some products needs manufacturing time, the manufacturing process will take approximately 10-30 business days depending on the product. This timeframe may vary depending on the complexity of the product and current demand. but this will be communicated with you during order confirmation.
- Returns and Exchanges: We offer a 30-day return policy for most items. If you are not completely satisfied with your purchase, you may return it within 30 days of receipt for a refund or exchange. Items must be unused, in their original packaging, and accompanied by proof of purchase. Return shipping costs are the responsibility of the customer, unless the item was damaged or defective upon arrival.
1. What is the Oven High Reflow Technology Vacuum Soldering used for?
The Oven High Reflow Technology Vacuum Soldering is designed for soldering components in data center hardware, manufacturing electronic devices, repairing and maintaining circuit boards, prototyping new electronic products, and quality control in production lines.
2. What are the dimensions of the soldering oven?
The dimensions of the Oven High Reflow Technology Vacuum Soldering are 1470 cm in length, 1420 cm in width, and 1745 cm in height.
3. How much does the oven weigh?
The total weight of the Oven High Reflow Technology Vacuum Soldering is 230 KG.
4. Is this soldering oven new or used?
The Oven High Reflow Technology Vacuum Soldering is in new condition, ensuring reliability and performance.
5. What brand is the Oven High Reflow Technology Vacuum Soldering?
The oven is manufactured by Opto-Intel.
6. What type of soldering does this oven perform?
This oven performs reflow soldering, which is ideal for electronic components.
7. What are the key features of this soldering oven?
Key features include high reflow technology for precision soldering, a vacuum environment to reduce defects, robust build quality, and compact dimensions suitable for any workspace.
8. Can this oven be used for prototyping new electronic products?
Yes, the Oven High Reflow Technology Vacuum Soldering is suitable for prototyping new electronic products.
9. What kind of maintenance is required for the soldering oven?
Regular maintenance includes cleaning the internal components, checking for wear on heating elements, and ensuring the vacuum environment is functioning properly.
10. Is this oven suitable for small-scale production?
Yes, the compact design and high precision of the oven make it suitable for small-scale production as well as larger manufacturing needs.
11. What safety features does the oven have?
The oven is designed with safety features that include temperature controls, overheat protection, and secure ventilation to ensure safe operation.
12. How does the vacuum environment benefit soldering?
The vacuum environment reduces defects in solder joints by minimizing the presence of air, which can cause oxidation and other soldering issues.
13. What is the selling unit for this product?
The Oven High Reflow Technology Vacuum Soldering is sold as a single item.
14. Can this soldering oven be used for repairing circuit boards?
Yes, it is effective for repairing and maintaining circuit boards, ensuring high-quality solder joints.
15. What support options are available after purchase?
Support options typically include customer service for troubleshooting, warranty services, and access to user manuals and guides.
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