Magnetron Plasma Gold Sputtering Coater

It is a compact laboratory coating unit that integrates magnetron plasma sputtering and evaporation in one small machine. It is designed primarily to prepare SEM and EDAX samples for microstructure and micro-area composition analysis by applying conductive or thin film coatings (e.g., gold or carbon).

Host dimensions: L360 × W300 × H380 mm. Vacuum chamber: diameter 160 mm, height 120 mm. Standard target: gold, Ø50 mm, thickness 0.1 mm. Sputtering area: Ø50 mm. Vacuum indicator: ≤ 4 × 10⁻² mbar. Mechanical (rotary vane) pump capacity: 2 L/s. Chiller included.

The unit ships with a gold target (Ø50 mm, 0.1 mm thick) and is designed to coat gold and other materials, including carbon. If you need other target materials, contact the supplier to confirm availability and compatibility.

The vacuum indicator specification is ≤ 4 × 10⁻² mbar. Actual base pressure reached in practice depends on sample outgassing, pump condition, gas loads and operational settings.

The unit includes a double-step rotary vane vacuum pump (mechanical pump) with a rated pumping speed of 2 L/s. It also supports the use of process gases as required for sputtering.

In our laboratory tests a typical gold coating sufficient for SEM imaging was achieved in about 30 seconds. Coating time depends on desired film thickness, target material, power settings and sample geometry, so times should be calibrated for your application.

Yes — the system is intended for SEM and EDAX sample preparation. Note: metallic coatings such as gold can introduce X-ray peaks that may obscure or interfere with elemental analysis for some elements. For EDAX where spectral interference is a concern, carbon coating is commonly used instead of gold.

Thickness is normally controlled by adjusting deposition time and process power (current/voltage). The unit does not list an integrated thickness monitor in the provided spec, so users typically calibrate deposition rate using test runs and measure thickness with profilometry, ellipsometry or cross-sectional SEM.

The available internal space is a cylinder Ø160 mm × 120 mm high. The number of samples depends on their size and the sample holder used. Contact the supplier for specific sample-holder accessories and recommendations for batch loading.

Regular maintenance includes keeping the chamber clean, removing sputter debris, checking and changing vacuum pump oil per the pump manufacturer's schedule, inspecting and replacing targets when depleted, and servicing the chiller as recommended. Follow the user manual for detailed maintenance intervals.

Common consumables include target materials (e.g., gold, carbon targets), vacuum pump oil and seals, and possibly sample holders. Target lifetime depends on usage and process parameters, so keep spare targets on hand. Contact the vendor for official spare parts and recommended consumables.

The manufacturer reports long-term international customers and after-sale service support. Specific installation, training and warranty terms are provided by the supplier — contact them directly to arrange on-site installation or user training and to confirm warranty details.

Yes. The system involves vacuum, high voltage/ RF power for sputtering, and possibly process gases. Use appropriate electrical grounding, follow gas-handling procedures, avoid exposure to deposited particulates, and follow the safety instructions in the operator manual. Only trained personnel should operate or service the unit.

The unit integrates both magnetron plasma sputtering and evaporation capabilities. Mode switching and the required settings are covered in the user manual; contact the supplier if you need a demonstration or application-specific guidance.

For complete electrical requirements, detailed performance data (deposition rates for various materials), available accessories (sample holders, targets), pricing, lead times and installation specifications, contact the supplier or request the full datasheet and quote.