Industrial Machinery

Laboratory Semiconductor Devices Chip Manual and Semi-automatic Ultrasonic Wire Bonding Machine Ball Wedge Wire Bonder

SKU: 11000023893600
Category: Industrial Machinery

The Laboratory Semiconductor Devices Top-end Chip Manual and Semi-automatic Ultrasonic Wire Bonding Machine is designed for precision and efficiency. This advanced machine is perfect for creating strong and reliable connections in semiconductor devices. With its state-o...

R1,986,492

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Section:: Machinery
Category:: Industrial Machinery
SKU:: 11000023893600

Sold by Afrimart Online

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16 Dec, 2026

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Product Description

Laboratory Semiconductor Devices Top-end Chip Manual and Semi-automatic Ultrasonic Wire Bonding Machine Ball Wedge Wire Bonder

Specifications

Attribute	Details
Selling Units	Single item
Weight (KG)	50
Brand Name	Minder-hightech
Core Components	PLC
Model Number	MDZW-BW1880
Warranty	1 Year
Machinery Test Report	Provided
Video Outgoing Inspection	Provided

Key Features

Manual and semi-automatic operation for flexibility.
High precision ultrasonic bonding for strong connections.
Lightweight design at only 50 kg.
Easy to use with a user-friendly interface.
Durable and reliable for long-term use.

Applications

Used in semiconductor device manufacturing.
Ideal for research and development labs.
Perfect for electrical and electronic assembly.
Suitable for prototyping and production runs.
Great for quality control in manufacturing processes.

Product Info Gallery

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Frequently Asked Questions

What is the main function of the Ultrasonic Wire Bonding Machine?

The Ultrasonic Wire Bonding Machine is designed to create strong and reliable connections in semiconductor devices using high precision ultrasonic bonding.

What are the key features of this machine?

Key features include manual and semi-automatic operation, high precision ultrasonic bonding, a lightweight design of only 50 kg, a user-friendly interface, and durability for long-term use.

What types of applications is this machine suitable for?

This machine is ideal for semiconductor device manufacturing, research and development labs, electrical and electronic assembly, prototyping, production runs, and quality control in manufacturing processes.

What is the warranty period for this product?

The product comes with a 1-year warranty.

Is there a user manual available?

Yes, a comprehensive user manual is provided to help you understand the operation and maintenance of the machine.

How heavy is the machine?

The machine weighs 50 kg, making it relatively lightweight for easy handling and setup.

Does the machine come with a machinery test report?

Yes, a machinery test report is provided with the machine to ensure it meets quality and performance standards.

Is video outgoing inspection available?

Yes, video outgoing inspection is provided to demonstrate the machine's functionality before delivery.

Can this machine be used for both prototyping and production runs?

Absolutely! The machine is designed to be versatile, making it suitable for both prototyping and larger production runs.

What brand is this ultrasonic wire bonding machine?

This machine is manufactured by Minder-hightech.

How does the manual and semi-automatic operation work?

The machine offers flexibility by allowing users to choose between manual operation for complete control and semi-automatic operation for increased efficiency.

What is the model number of this machine?

The model number of this ultrasonic wire bonding machine is MDZW-BW1880.

Is training provided for using this machine?

While training is not included, the user-friendly interface and manual make it straightforward to operate. Additional training can be requested from the manufacturer.

What are the dimensions of the machine?

The specific dimensions are not provided in the description, but the lightweight design aids in portability.

What materials can be bonded using this machine?

The machine is suitable for bonding various materials commonly used in semiconductor devices, including gold and aluminum wires.