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The High Precision Crystal Ceramic Wafer Grinding and Polishing Machine is designed for labs that need high-quality results. This machine is easy to operate and provides excellent precision. With its adjustable speed and advanced features, it is perfect for grinding and...
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The High Precision Crystal Ceramic Wafer Grinding and Polishing Machine is designed for labs that need high-quality results. This machine is easy to operate and provides excellent precision. With its adjustable speed and advanced features, it is perfect for grinding and polishing tasks.
| Attribute | Details |
|---|---|
| Power (kw) | 0.5 |
| Weight (kg) | 70 |
| Brand Name | CYKY |
| Machine Type | Metal Polishing Machine |
| Product | Lapping and Polishing Machine |
| Super-Flat Diameter | 12" |
| Flatness | Less than 0.25 micron/inch |
| Precision Rotating Shaft | Running Off < 5 microns |
| Speed Adjustment | 9 rocking/minute |
| Condition Rings | 120 O.D. x 110 I.D. x 32 T mm |
| Variable Speed | 0~150 rpm |
| Certification | CE |
| Packaging Details | Wooden case |
| Supply Ability | 100 Set/Sets per Month |
| Power | 0.5 kW |
|---|
The High Precision Crystal Ceramic Wafer Grinding and Polishing Machine can achieve a flatness of less than 0.25 microns per inch.
The machine weighs 70 kg, making it relatively lightweight for its capabilities.
The machine has a power rating of 0.5 kW.
The machine offers adjustable speed settings from 0 to 150 rpm.
Yes, the machine is designed to be easy to operate for all users, with intuitive controls.
The machine is CE certified, ensuring compliance with European safety standards.
It is ideal for lab environments needing precise wafer grinding, polishing ceramic and metal surfaces, and is applicable in research and manufacturing processes.
The condition rings have dimensions of 120 O.D. x 110 I.D. x 32 T mm.
Yes, the machine includes online support and video technical assistance to help users with operation and troubleshooting.
The supply ability for this machine is 100 sets per month.
The super-flat diameter that the machine can handle is 12 inches.
Yes, it is helpful in creating prototypes in engineering labs due to its high precision.
This machine is classified as a metal polishing machine and is specifically a lapping and polishing machine.
The precision rotating shaft runs off at less than 5 microns, ensuring high precision operations.
The machine is packaged in a wooden case to ensure safe transport.
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