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The Automatic Solar Cell Laser Silicon Wafer Panel Cutting Scribe Scribing Etching Cutter Dicing Machine Systems is a state-of-the-art tool designed for precision cutting and scribing of solar cells. This advanced machine helps create clean and accurate cuts in monocrys...
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The Automatic Solar Cell Laser Silicon Wafer Panel Cutting Scribe Scribing Etching Cutter Dicing Machine Systems is a state-of-the-art tool designed for precision cutting and scribing of solar cells. This advanced machine helps create clean and accurate cuts in monocrystalline, polysilicon, and amorphous silicon materials. With its high-speed capabilities and user-friendly features, it is perfect for manufacturers looking to enhance their production efficiency.
| Attribute | Details |
|---|---|
| Power | 20w, 50w |
| Scribing Line Width | 50um |
| Scribing Precision | ±10um |
| Scribing Speed | 240mm/s |
| Weight | 310.000 kg |
| Working Area | 2000*200mm (Auto moving table) |
| Cooling Mode | Air Cooling |
| Warranty | 3 years |
| Laser Type | Fiber Laser |
| Graphic Format Supported | AI, PLT, DXF, DXP |
No approved technical specifications are available yet. Please refer to the product description or contact our team.
The machine is designed to cut and scribe monocrystalline, polysilicon, and amorphous silicon materials.
The maximum scribing speed is up to 240mm/s, making it highly efficient for production.
The scribing precision is ±10um, ensuring clean and accurate cuts.
The working area is 2000*200mm with an auto-moving table, allowing for larger projects.
The machine offers power options of 20w and 50w, depending on your cutting needs.
The cooling mode used is air cooling, which helps maintain optimal operating temperatures.
The machine comes with a 3-year warranty, covering various aspects of operation.
Yes, it features a user-friendly control system designed for easy operation, even for beginners.
The machine supports AI, PLT, DXF, and DXP graphic formats for flexibility in design.
Absolutely, it is suitable for research and development in solar technology as well as for manufacturing.
Key features include high-speed scribing, precision cutting, compatibility with various silicon materials, and a durable design.
Yes, its high-speed capabilities and precision make it ideal for enhancing production lines in solar panel manufacturing.
The machine weighs 310.000 kg, making it robust and stable during operation.
Regular cleaning and periodic checks of the cooling and laser systems are recommended to ensure optimal performance.
By precisely cutting and scribing solar cells, the machine enhances the efficiency and effectiveness of solar panel manufacturing, ultimately contributing to energy production.
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