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Form a closed loop system with SPl on line,when after receiving the SPl printing bad feedback,the machine will automatically adjust automatically according to the offsetof SPl feedback,x,y direction deviation can automatically adjust to complete,and automatic cleaning s...
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Form a closed loop system with SPl on line,when after receiving the SPl printing bad feedback,the machine will automatically adjust automatically according to the offsetof SPl feedback,x,y direction deviation can automatically adjust to complete,and automatic cleaning stencil,improve printingquality and production efficiency, form a complete printing feedback system.
Can be real-time monitoring the roll diameter of the solder paste on screen,trigger automatically add runctionality
The solder paste inspection sensor before the scraper below remaining paste rolling diameter,intelligent prompt customers to join the solder paste.
| Printing Accuracy | >2Cpk@±25μm@,6σ |
| Repeat Position Accuracy | >2Cpk@±10μm@,6σ |
| Cycle Time | 7s |
| Maximum Print Area | 400mm(X)x340mm(Y) |
| Screen Frame Size | 470mmx370mm~737mmx737mm |
| Screen Frame Thickness | 25mm-40mm |
| Print Pressure | 0kg-10kg |
| Print Speed | 1mm/sec-200mm/sec |
| Print Gap | 0mm-20mm |
| Substrate Separation | 0.1-20mm/s Speed:0.1mm/sec-20mm/sec |
| 0mm-3mm Distance:0mm-3mm | |
| Separation option | Separation after squeegee up;Squeegee up after separation |
| Apply paste option | solder paste,printing ink,silver paste |
| Printer Construction | One piece optimized welded frame |
| Machine Control | Three control motion control card |
| Operation System | Windows XP, Win7 Windows XP,Win7(option) |
| Operator Interface | 17 "DELL display screen,keyboard and mouse and DESEN V2 software, display on the right hand side. |
| Squeegee | Direct screw/single-point suspension squeegee |
| Constant intelligent control system of squeegee pressure | Pressure adjusted by software control |
| Automatic positioning module of stencil | Put the stencil into the support frame,the squeegee automatically realizes the positioning of the stencil |
| Support positioning system | Support block,support pin,support platform |
| Intelligent cleaning system | The diffrent size of wipe paper can be used,less paper consumption,solvent agent control module |
| Printing Accuracy | >2Cpk@±25μm@,6σ |
|---|---|
| Repeat Position Accuracy | >2Cpk@±10μm@,6σ |
| Cycle Time | 7s |
| Maximum Print Area | 400mm(X)x340mm(Y) |
| Screen Frame Size | 470mmx370mm~737mmx737mm |
| Screen Frame Thickness | 25mm-40mm |
| Print Pressure | 0kg-10kg |
| Print Speed | 1mm/sec-200mm/sec |
| Print Gap | 0mm-20mm |
| Substrate Separation | 0.1-20mm/s Speed:0.1mm/sec-20mm/sec |
| Separation option | Separation after squeegee up;Squeegee up after separation |
| Apply paste option | solder paste,printing ink,silver paste |
| Printer Construction | One piece optimized welded frame |
| Machine Control | Three control motion control card |
| Operation System | Windows XP, Win7 Windows XP,Win7(option) |
| Operator Interface | 17 "DELL display screen,keyboard and mouse and DESEN V2 software, display on the right hand side. |
| Squeegee | Direct screw/single-point suspension squeegee |
| Constant intelligent control system of squeegee pressure | Pressure adjusted by software control |
| Automatic positioning module of stencil | Put the stencil into the support frame,the squeegee automatically realizes the positioning of the stencil |
| Support positioning system | Support block,support pin,support platform |
| Intelligent cleaning system | The diffrent size of wipe paper can be used,less paper consumption,solvent agent control module |
The maximum print area of the machine is 400mm (X) x 340mm (Y).
The machine features a closed-loop system with SPI feedback, which allows it to automatically adjust for deviations and includes an automatic cleaning system for the stencil.
The printer can apply solder paste, printing ink, and silver paste.
The cycle time for the Automatic SMT Solder Paste Printing Machine is 7 seconds.
The machine utilizes a three-control motion control card and operates on Windows XP or Windows 7.
The machine can monitor the roll diameter of solder paste in real-time and trigger automatic replenishment when necessary.
The repeat position accuracy is >2Cpk@±10μm@, 6σ.
Yes, the machine features a user-friendly interface with a 17-inch DELL display, keyboard, and mouse, along with DESEN V2 software.
The print speed ranges from 1mm/sec to 200mm/sec.
Yes, the machine can separate substrates at speeds of 0.1-20mm/s with a distance option of 0mm-3mm.
The print pressure can be adjusted between 0kg to 10kg.
Yes, it features an intelligent cleaning system that minimizes paper consumption and allows the use of different sizes of wipe paper.
The stencil is automatically positioned by the machine once placed into the support frame, allowing for precise alignment.
The screen frame size compatibility ranges from 470mm x 370mm to 737mm x 737mm.
The machine includes a solvent agent control module, allowing for various solvent types to be used for stencil cleaning.
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