The sputtering deposition system is equipped with a plurality of cylindrical targets on the side wall to improve the deposition rate and multilayer coating. The system is equipped with a DC pulse or RF power circular cathode. The vertically mounted substrate and cylindrical cathode can minimize the particle pollution in the coating process.

Compared with the ordinary plane target device in the industry, the service cycle and utilization efficiency of the target material of the rotating cathode device are significantly improved; the customized structure of the base plate workpiece frame can provide the maximum utilization space for the customer’s product placement; the fully automatic lifting and lifting frame device can greatly reduce the opening and closing time of the machine and greatly improve the production efficiency and process stability; the patent separation The sub source has the characteristics of wide energy balance, high isolation rate, super stable working efficiency and low energy consumption.

It can use time to precisely control the film thickness, meet the design process requirements, save crystal control and optical control links, and save a large number of film thickness instrument consumables for customers; it can produce high refractive index nitriding film, improve the film hardness performance; it can be used for various purposes at low temperature; it can automatically adjust the gas flow patent device, maintain a stable target voltage, and ensure the film quality; optional “correction plate” External adjustment mechanism “.