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The VSR-20 Vacuum Solder Reflow Oven is a cutting-edge solution designed for high-power semiconductor and optical communication device packaging. This advanced reflow oven uses microwave plasma technology to ensure void-free soldering, making it ideal for high-performan...
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The VSR-20 Vacuum Solder Reflow Oven is a cutting-edge solution designed for high-power semiconductor and optical communication device packaging. This advanced reflow oven uses microwave plasma technology to ensure void-free soldering, making it ideal for high-performance applications. With precise temperature control and robust specifications, the VSR-20 is built to meet the demanding needs of modern electronics manufacturing.
| Attribute | Details |
|---|---|
| Microwave Power | 2.45GHz, 100-1000W |
| Temperature Control Precision | ±0.5℃ |
| Single Gross Weight | 235.000 kg |
| Single Package Size | 147X142X174 cm |
| Dimensions | 1340*1170*1600mm |
| Weight | 260 kg |
| Warranty | 1 Year |
| Microwave Power | 2.45GHz, 100-1000W |
|---|---|
| Temperature Control Precision | ±0.5℃ |
| Single Gross Weight | 235.000 kg |
| Single Package Size | 147X142X174 cm |
| Dimensions | 1340*1170*1600mm |
| Weight | 260 kg |
| Warranty | 1 Year |
The VSR-20 is designed for high-power semiconductor and optical communication device packaging, ensuring void-free soldering for high-performance applications.
The VSR-20 utilizes advanced microwave plasma technology to achieve void-free soldering, making it highly effective for electronic manufacturing.
The VSR-20 features precise temperature control with an accuracy of ±0.5℃.
The VSR-20 has a total weight of 260 kg, which contributes to its stability during operation.
The VSR-20 operates with a microwave power range from 100W to 1000W, suitable for various applications.
The VSR-20 has dimensions of 1340 mm x 1170 mm x 1600 mm.
Yes, the VSR-20 comes with a 1-year warranty.
The oven is suitable for the production of reliable and high-performance electronic products, particularly in the fields of semiconductor and optical communication.
Yes, the VSR-20 is also designed for research and development in advanced electronics.
The single package size for the VSR-20 is 147 cm x 142 cm x 174 cm.
The VSR-20 uses microwave plasma technology which effectively eliminates voids during the soldering process, ensuring high-quality connections.
Industries involved in semiconductor manufacturing, optical communication, and electronic device packaging would greatly benefit from the VSR-20.
Yes, the VSR-20 is built to meet the demanding needs of modern electronics manufacturing, making it suitable for high-volume production.
While specific safety features are not detailed in the provided description, advanced reflow ovens typically include safety mechanisms to ensure safe operation during soldering processes.
Regular maintenance, including cleaning and calibration of temperature controls, is recommended to ensure optimal performance of the VSR-20.
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