RF-B830T Reflow Soldering Machine 8 Warm Zone Air Reflow Solders Welding Equipment Pcb Solder Reflow Oven for Smt Production

The RF-B830T is designed for SMT production, PCB assembly, repair/rework, prototyping and small- to large-batch electronics manufacturing that require reliable reflow soldering.

It has eight warm (heating) zones. Multiple zones allow more precise temperature profiling across preheat, soak and reflow stages, improving solder joint quality and process control.

The RF-B830T uses hot wind (hot air) heating, which promotes uniform temperature distribution across the PCB and components.

Standard input supply options are 220 V or 380 V. Rated capacity is 220V 50/60Hz. Starting (inrush) power is 11 kW and typical working power is 3.5 kW. Current spec lists AC 220V ±5% 50/60Hz.

Conveyor (rated duty) speed is adjustable from 0 to 1350 mm/min. Throughput depends on board length and process time—for example, at 1350 mm/min a 100 mm board would pass the heating zones at about 13.5 boards per minute.

Machine dimensions are L2440 × W680 × H1200 mm. Net weight is 250 kg; single package size is 260 × 81 × 135 cm with a gross weight of approximately 300 kg.

The net belt width is 300 mm, so PCB assemblies must fit within that width (including fixturing or carrier rails).

Yes, the product is listed with CE certification and is built for industrial SMT production environments.

The RF-B830T’s eight-zone design enables precise thermal profiling across the line. For details on programming temperature ramps, setpoints and controllers supported, consult the user manual or contact the supplier for controller documentation.

You should ensure sufficient floor space for the machine and its package, a stable level surface, proper ventilation or fume extraction, and an appropriate electrical supply (220 V or 380 V) with adequate capacity and breaker protection. Professional installation and electrical hookup are recommended.

Routine maintenance includes keeping the conveyor and belt clean, checking and cleaning fans and air ducts, inspecting heating elements and sensors, verifying belt alignment, and following the manufacturer’s preventive maintenance schedule. Replace worn parts as needed to maintain process stability.

Yes. Operators should be trained in safe operation, temperature profiling, conveyor speed adjustment, basic troubleshooting, and safety procedures (including electrical safety and ventilation).

Start by consulting component and solder paste manufacturer recommended reflow profiles. Use thermal profiling equipment (thermocouples/data logger) to measure actual board temperatures through the zones and adjust zone setpoints and conveyor speed until the measured profile meets the recommended ramp, soak and peak temperatures.

Warranty terms, spare parts availability and technical support vary by seller. Contact the supplier or manufacturer for specific warranty coverage, lead times for spare parts and available service or support contracts.