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PVD Device 2inch Molecular Beam Epitaxy System Used for Thin Film Processing and Manufacturing with Film Thickness Measurement

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  • Shipping Timeframes: All orders are processed within 2-5 business days (excluding weekends and holidays). After your order has been processed, the estimated delivery time is before 26 Dec, 2025, depending on customs, Please note that due to high demand, some items may experience longer shipping times, which will be communicated at order confirmation email.
  • Order Processing Time: Please allow 2-5 business days for us to process your order before it is shipped . Orders placed after 16:00 on Fridays, or during weekends and public holidays, will begin processing on the next business day. Processing times may be extended during peak seasons or sales events.
  • Manufacturing Time: Some products needs manufacturing time, the manufacturing process will take approximately 10-30 business days depending on the product. This timeframe may vary depending on the complexity of the product and current demand. but this will be communicated with you during order confirmation.
  • Returns and Exchanges: We offer a 30-day return policy for most items. If you are not completely satisfied with your purchase, you may return it within 30 days of receipt for a refund or exchange. Items must be unused, in their original packaging, and accompanied by proof of purchase. Return shipping costs are the responsibility of the customer, unless the item was damaged or defective upon arrival.
1. What is the primary application of the PVD Device 2inch Molecular Beam Epitaxy System?

The primary application of the PVD Device is for thin film processing and manufacturing, particularly in electronics applications.

2. What is the maximum operating temperature of the system?

The system can operate at temperatures ranging from room temperature (RT) to 800°C, with an optional range up to 1200°C.

3. How does the film thickness measurement work?

The device features a retractable thickness monitor that provides high precision in measuring the film thickness during the deposition process.

4. What kind of vacuum system does this device use?

The vacuum system includes a mechanical pump, molecular pump, adsorption pump, and a cold trap, ensuring superior performance with an ultimate vacuum better than 1*10^-10 mbar.

5. How many wafers can the load chamber accommodate?

The load chamber can accommodate up to 6 pieces of 2-inch wafers.

6. Is the operation of the system fully automated?

Yes, the PVD Device features a fully automatic operation control system using PC and PLC, along with safety interlocks for ease of use.

7. What is the weight of the PVD Device?

The weight of the PVD Device is approximately 200 kg.

8. What power supply does the device require?

The device operates on a power supply of 1000W at a voltage of 220V.

9. What kind of warranty is provided with the system?

The PVD Device comes with a 1-year warranty.

10. Can this device be used for semiconductor fabrication?

Yes, the system is suitable for semiconductor fabrication as well as various other applications in thin film research and development.

11. Are there multiple evaporation sources available?

Yes, the system includes 6-10 in-situ monitoring evaporation sources, providing versatility for different applications.

12. What are the key features of the PVD Device?

Key features include fully automatic operation, high precision in film thickness measurement, a robust vacuum system, multiple evaporation sources, and customizable dimensions.

13. What types of coatings can be applied using this system?

The system can be used for optical coatings, coating and surface treatment processes, and manufacturing electronic components.

14. Is training provided for operating the PVD Device?

While the device is designed for easy use, specific training may be available depending on the supplier; it is advisable to check with them for details.

15. Can the system be customized to fit specific needs?

Yes, the dimensions of the system can be customized to fit your specific requirements.

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