The machine is designed specifically for semiconductor materials, including silicon wafers and other optical components.
The Precision Grinding and Polishing Machine weighs 100 KG.
It comes with a one-year warranty, providing peace of mind for customers.
Yes, comprehensive machinery test reports are provided for quality assurance.
The robust PLC control system allows for ease of operation, enabling precise adjustments during the grinding and polishing processes.
Yes, a video of the outgoing inspection is provided to showcase the machine's performance.
It is ideal for manufacturing semiconductor wafers, polishing optical components, preparing surfaces for electronic devices, and enhancing surface quality in research labs.
The machine features a compact design, making it suitable for various workspaces while weighing only 100 KG.
Yes, it is perfect for enhancing surface quality in research labs as well as finishing processes in the electronics industry.
The model number is MDAM-CMP100.
Yes, the PLC control system is designed for easy operation, allowing users to efficiently manage the grinding and polishing processes.
The Precision Grinding and Polishing Machine is manufactured by minder-hightech.
The machine's high precision grinding and polishing capabilities ensure a smooth and precise finish, while test reports provide additional quality assurance.
The semiconductor manufacturing industry, electronics industry, and research laboratories are among the primary beneficiaries of this machine.
Regular maintenance checks and proper cleaning after use are recommended to ensure optimal performance and longevity of the machine.
Discover our latest orders