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The Parallel Double-sided Surfaces Grinding Polishing Lapping Machine is designed for precision in machining semiconductor and metal materials. With advanced technology and high-quality components, this machine delivers excellent performance. It is ideal for businesses...
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The Parallel Double-sided Surfaces Grinding Polishing Lapping Machine is designed for precision in machining semiconductor and metal materials. With advanced technology and high-quality components, this machine delivers excellent performance. It is ideal for businesses looking to enhance their production capabilities while maintaining competitive pricing.
| Attribute | Details |
|---|---|
| Brand Name | MINDER-HIGHTECH |
| CNC or Not | CNC |
| Grinding Length (mm) | 1000 |
| Wheel Size (mm) | 1000 |
| Table Size (mm) | 10000 |
| Weight (kg) | 2000 |
| Power (kW) | 10000 |
| Voltage | 380 V, 220 V |
| Warranty | 1 Year |
| Video Outgoing Inspection | Provided |
| Machinery Test Report | Provided |
| Brand Name | MINDER-HIGHTECH |
|---|---|
| CNC or Not | CNC |
| Grinding Length (mm) | 1000 |
| Wheel Size (mm) | 1000 |
| Table Size (mm) | 10000 |
| Weight (kg) | 2000 |
| Power (kW) | 10000 |
| Voltage | 380 V, 220 V |
| Warranty | 1 Year |
| Video Outgoing Inspection | Provided |
| Machinery Test Report | Provided |
The machine is designed to grind, polish, and lap semiconductor materials and various metal materials.
The maximum grinding length of the machine is 1000 mm.
Yes, the Parallel Double-sided Surfaces Grinding Polishing Lapping Machine is CNC controlled for precision operations.
The machine requires a power supply of 10 kW and operates on either 380 V or 220 V.
The machine weighs approximately 2000 kg.
Yes, the machine comes with a 1-year warranty.
Key features include high precision grinding and polishing, robust construction for durability, easy CNC operation, and efficient performance for large-scale production.
Yes, a video outgoing inspection is provided for the machine.
Yes, a machinery test report is provided with the machine.
The machine is suitable for grinding semiconductor wafers, polishing metal components in electronics, lapping surfaces for precision machining, manufacturing optical devices, and producing automotive parts.
The machine enhances production capabilities by delivering efficient performance and high precision, allowing businesses to produce high-quality components at a competitive rate.
The size of the grinding wheel is 1000 mm.
Yes, the machine is designed to be easy to operate with user-friendly CNC controls.
The table size of the machine is 10000 mm.
The machine is manufactured by MINDER-HIGHTECH.
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