Converye Reflow Oven Batch Vacuum Nitrogen Air Reflow Oven for PCB Soldering

A high-performance reflow oven designed for PCB soldering that combines vacuum and nitrogen atmosphere capability with air reflow. It is intended for professional and industrial SMT/SMD assembly and LED tube manufacturing, offering improved solder quality and production reliability.

Type: Reflow solder oven; Voltage/Power supply: 3-phase, 380V, 50/60Hz; Rated power: 5300W; Rated duty cycle: 100%; Dimensions: 5050 x 1350 x 1530 mm; Weight: 2050 kg; Current: Alternating Current.

Vacuum nitrogen technology creates an inert, low-oxygen environment around the PCB during reflow. This reduces oxidation, improves wetting, lowers void formation in solder joints, and results in higher yields and more reliable solder connections.

Yes. The oven's high-precision temperature control and inert atmosphere are suitable for lead-free reflow profiles; however, profiles should be tuned and validated for your specific solder paste, components, and board design.

It is ideal for SMT and SMD PCB assemblies, LED tube manufacturing, and general electronics manufacturing environments where high-quality reflow and void reduction are required.

This model is described as a batch vacuum nitrogen air reflow oven. If you require a continuous inline conveyor configuration, check with the supplier for conveyorized variants or retrofit options.

You need a 3-phase 380V 50/60Hz power feed sized for the oven, adequate floor loading capacity for ~2050 kg, sufficient clearance for the stated dimensions plus service access, proper ventilation/exhaust, and a nitrogen supply/regulator if external nitrogen is required.

The product uses vacuum nitrogen technology, but whether the nitrogen supply and vacuum pump are integrated varies by model/configuration. Confirm with the vendor if an external bottled or bulk nitrogen source, regulators, or external vacuum pump are required.

Nitrogen consumption depends on model configuration, process settings and cycle frequency. The exact consumption rate is not listed in the basic specs—contact the supplier for measured consumption figures for your planned process.

Typical maintenance includes periodic cleaning of the chamber and conveyor fixtures, filter replacement, vacuum pump oil/service (if applicable), inspection and replacement of heating elements and thermocouples as needed, and routine calibration of temperature profiles.

Ensure compliance with electrical codes for 3-phase equipment, provide ventilation for any exhaust, implement nitrogen safety procedures (asphyxiation hazard in confined spaces), train operators on hot surfaces and emergency stops, and follow lockout/tagout procedures for servicing.

Develop a profile by measuring temperature at representative component locations (thermocouples), then adjust zone temperatures, conveyor speed, and vacuum/nitrogen settings to meet ramp, soak and peak requirements of your solder paste and components. Validate with multiple runs and X-ray or cross-sectioning if voids are a concern.

Throughput depends on PCB size, batch load configuration and cycle times. The listed 5300W is the rated power, not a direct throughput metric. Ask the supplier for typical cycle time and parts-per-hour data based on your PCB dimensions.

The oven weighs approximately 2050 kg and will likely require a forklift or crane for unloading and placement. Ensure adequate doorways, freight elevator capacity (if applicable), and a solid, level floor. Coordinate with the vendor for installation services if needed.

Warranty terms, spare parts availability and support packages vary by supplier. Request written warranty details, recommended spare parts list (heaters, thermocouples, filters, vacuum pump consumables), and available maintenance or training contracts prior to purchase.