The primary function of the machine is to perform wire bonding for semiconductor packaging, specifically using aluminum and gold wires.
Key features include manual and semi-automatic operation, high precision with advanced technology, robust PLC core components, lightweight design (50 KG), and comprehensive test reports and video inspection.
The machine weighs 50 KG.
The machine comes with a 1-year warranty.
Yes, training can be provided upon request to help operators get familiar with the manual and semi-automatic functions of the machine.
Yes, this machine is designed for effective bonding using both aluminum and gold wires.
This machine is ideal for the semiconductor packaging industry and suitable for various electronics manufacturing processes.
Yes, comprehensive video inspection is provided to ensure quality control.
The price of the machine starts at US$ 270,000.
Yes, it is effective for research and development in semiconductor technology.
The manual-semi automatic feature allows for flexibility in operation, enabling users to choose between manual control for precision and semi-automatic for efficiency.
Comprehensive machinery test reports are provided to verify the performance and reliability of the machine.
Yes, the machine is designed for user-friendly operation, combining both manual and semi-automatic features to accommodate different skill levels.
The machine uses robust PLC core components, ensuring reliability and efficiency in operation.
Yes, it is suitable for both manual and semi-automated production lines, making it easy to integrate into existing setups.
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