The main purpose of the Multi-layer Formic Acid Vacuum Soldering Reflow Oven is to provide high precision and efficiency in chip soldering, specifically for semiconductor packaging.
The dimensions of the Multi-layer Formic Acid Vacuum Soldering Reflow Oven are 1400mm x 900mm x 2150mm.
The soldering oven operates on a voltage of 380V.
The Multi-layer Formic Acid Vacuum Soldering Reflow Oven weighs 550 KG.
The temperature range of the reflow oven is from room temperature to 400℃.
The Multi-layer Formic Acid Vacuum Soldering Reflow Oven features a 3-layer design.
The oven utilizes nitrogen and formic acid for improved solder quality during the soldering process.
The platform cooling speed of the oven is between 100-120℃ per minute.
The temperature control in the Multi-layer Formic Acid Vacuum Soldering Reflow Oven is precise within ±1%.
The oven is used for semiconductor packaging, chip soldering in manufacturing processes, high-precision soldering in labs, research and development, and repair and maintenance of electronic products.
The platform heating speed of the oven is 35-40℃ per minute.
Yes, the Multi-layer Formic Acid Vacuum Soldering Reflow Oven is suitable for high-precision soldering in laboratories and production lines.
The oven is packaged in a standard export wooden box to ensure safe delivery.
The supply ability of the Multi-layer Formic Acid Vacuum Soldering Reflow Oven is 10 pieces per month.
The Multi-layer Formic Acid Vacuum Soldering Reflow Oven is brand new.
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