The Ultrasonic Wire Bonding Machine is designed to create strong and reliable connections in semiconductor devices using high precision ultrasonic bonding.
Key features include manual and semi-automatic operation, high precision ultrasonic bonding, a lightweight design of only 50 kg, a user-friendly interface, and durability for long-term use.
This machine is ideal for semiconductor device manufacturing, research and development labs, electrical and electronic assembly, prototyping, production runs, and quality control in manufacturing processes.
The product comes with a 1-year warranty.
Yes, a comprehensive user manual is provided to help you understand the operation and maintenance of the machine.
The machine weighs 50 kg, making it relatively lightweight for easy handling and setup.
Yes, a machinery test report is provided with the machine to ensure it meets quality and performance standards.
Yes, video outgoing inspection is provided to demonstrate the machine's functionality before delivery.
Absolutely! The machine is designed to be versatile, making it suitable for both prototyping and larger production runs.
This machine is manufactured by Minder-hightech.
The machine offers flexibility by allowing users to choose between manual operation for complete control and semi-automatic operation for increased efficiency.
The model number of this ultrasonic wire bonding machine is MDZW-BW1880.
While training is not included, the user-friendly interface and manual make it straightforward to operate. Additional training can be requested from the manufacturer.
The specific dimensions are not provided in the description, but the lightweight design aids in portability.
The machine is suitable for bonding various materials commonly used in semiconductor devices, including gold and aluminum wires.
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