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High Precision Crystal Ceramic Wafer Grinding and Polishing Machine for Lab

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  • Shipping Timeframes: All orders are processed within 2-5 business days (excluding weekends and holidays). After your order has been processed, the estimated delivery time is before 04 Feb, 2026, depending on customs, Please note that due to high demand, some items may experience longer shipping times, which will be communicated at order confirmation email.
  • Order Processing Time: Please allow 2-5 business days for us to process your order before it is shipped . Orders placed after 16:00 on Fridays, or during weekends and public holidays, will begin processing on the next business day. Processing times may be extended during peak seasons or sales events.
  • Manufacturing Time: Some products needs manufacturing time, the manufacturing process will take approximately 10-30 business days depending on the product. This timeframe may vary depending on the complexity of the product and current demand. but this will be communicated with you during order confirmation.
  • Returns and Exchanges: We offer a 30-day return policy for most items. If you are not completely satisfied with your purchase, you may return it within 30 days of receipt for a refund or exchange. Items must be unused, in their original packaging, and accompanied by proof of purchase. Return shipping costs are the responsibility of the customer, unless the item was damaged or defective upon arrival.
1. What is the maximum flatness achievable with this machine?

The High Precision Crystal Ceramic Wafer Grinding and Polishing Machine can achieve a flatness of less than 0.25 microns per inch.

2. What is the weight of the machine?

The machine weighs 70 kg, making it relatively lightweight for its capabilities.

3. What is the power consumption of the machine?

The machine has a power rating of 0.5 kW.

4. What is the variable speed range of the grinding and polishing machine?

The machine offers adjustable speed settings from 0 to 150 rpm.

5. Is the machine easy to operate?

Yes, the machine is designed to be easy to operate for all users, with intuitive controls.

6. What kind of certification does the machine have?

The machine is CE certified, ensuring compliance with European safety standards.

7. What applications is this machine suitable for?

It is ideal for lab environments needing precise wafer grinding, polishing ceramic and metal surfaces, and is applicable in research and manufacturing processes.

8. What are the dimensions of the condition rings included?

The condition rings have dimensions of 120 O.D. x 110 I.D. x 32 T mm.

9. Does the machine come with any technical support?

Yes, the machine includes online support and video technical assistance to help users with operation and troubleshooting.

10. How many units can be supplied per month?

The supply ability for this machine is 100 sets per month.

11. What is the super-flat diameter of the machine?

The super-flat diameter that the machine can handle is 12 inches.

12. Is this machine suitable for creating prototypes?

Yes, it is helpful in creating prototypes in engineering labs due to its high precision.

13. What type of machine is this classified as?

This machine is classified as a metal polishing machine and is specifically a lapping and polishing machine.

14. What is the running off tolerance for the precision rotating shaft?

The precision rotating shaft runs off at less than 5 microns, ensuring high precision operations.

15. How is the machine packaged for shipping?

The machine is packaged in a wooden case to ensure safe transport.

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