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TAB/ACF/FPC/PCB bar Pressing/bonding Machine TV Laptop LCD Screen Repairing Machine

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  • Shipping Timeframes: All orders are processed within 2-5 business days (excluding weekends and holidays). After your order has been processed, the estimated delivery time is before 03 Feb, 2026, depending on customs, Please note that due to high demand, some items may experience longer shipping times, which will be communicated at order confirmation email.
  • Order Processing Time: Please allow 2-5 business days for us to process your order before it is shipped . Orders placed after 16:00 on Fridays, or during weekends and public holidays, will begin processing on the next business day. Processing times may be extended during peak seasons or sales events.
  • Manufacturing Time: Some products needs manufacturing time, the manufacturing process will take approximately 10-30 business days depending on the product. This timeframe may vary depending on the complexity of the product and current demand. but this will be communicated with you during order confirmation.
  • Returns and Exchanges: We offer a 30-day return policy for most items. If you are not completely satisfied with your purchase, you may return it within 30 days of receipt for a refund or exchange. Items must be unused, in their original packaging, and accompanied by proof of purchase. Return shipping costs are the responsibility of the customer, unless the item was damaged or defective upon arrival.
1. What is the primary use of the TAB/ACF/FPC/PCB Bar Pressing/Bonding Machine?

The primary use of the TAB/ACF/FPC/PCB Bar Pressing/Bonding Machine is to repair LCD screens for TVs and laptops by effectively bonding electronic components.

2. What types of materials can this machine bond?

This machine can bond various types of materials including TAB, ACF, FPC, and PCB, making it versatile for different repair applications.

3. What is the adaptive viscosity range of the machine?

The adaptive viscosity range of the machine is between 50 and 500,000 mPas, allowing it to handle a wide variety of adhesives.

4. How does the machine operate?

The machine operates using a pneumatic cylinder driving mode, which ensures smooth and efficient operation during the bonding process.

5. What is the capacity of the stainless steel material tank?

The stainless steel material tank has a capacity of 10 to 100 liters, providing ample space for adhesive materials.

6. What is the output precision of the machine?

The output precision of the machine is 3%, ensuring that the adhesive is dispensed accurately for high-quality repairs.

7. What is the mix. ratio precision and range?

The mix ratio precision is ±3, and the mix ratio range is from 100:100 to 100:1, allowing for precise mixing of adhesives.

8. What are the mixed modes available in this machine?

The machine offers both static mixing and dynamic mixing modes, catering to different adhesive applications and requirements.

9. What are the packaging details for the machine?

The machine is packaged in a standard ISPM-15 polywood box, ensuring safe and secure delivery.

10. How many units can be supplied per month?

The machine has a supply ability of 30 sets per month, making it readily available for professional use.

11. Who can benefit from using this machine?

This machine is ideal for technicians and repair specialists working in professional electronics repair shops, enhancing their repair capabilities.

12. What is the output range of adhesive per shot?

The output range of adhesive per shot is between 15.00 and 295.00 mL, providing flexibility based on repair needs.

13. Is this machine suitable for beginners in electronics repair?

While the machine is designed for professional use, beginners can also benefit from its precision and ease of operation with proper training.

14. What brand manufactures this bonding machine?

The bonding machine is manufactured by Longshen, a reputable brand in the electronics repair industry.

15. Can this machine improve the durability of repaired devices?

Yes, the machine enhances the durability of repaired devices by ensuring secure bonding of electronic components.

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