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Multi-layer Formic Acid Vacuum Soldering Reflow Oven Reflow Oven Semiconductor Packaging Soldering System

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  • Shipping Timeframes: All orders are processed within 2-5 business days (excluding weekends and holidays). After your order has been processed, the estimated delivery time is before 03 Feb, 2026, depending on customs, Please note that due to high demand, some items may experience longer shipping times, which will be communicated at order confirmation email.
  • Order Processing Time: Please allow 2-5 business days for us to process your order before it is shipped . Orders placed after 16:00 on Fridays, or during weekends and public holidays, will begin processing on the next business day. Processing times may be extended during peak seasons or sales events.
  • Manufacturing Time: Some products needs manufacturing time, the manufacturing process will take approximately 10-30 business days depending on the product. This timeframe may vary depending on the complexity of the product and current demand. but this will be communicated with you during order confirmation.
  • Returns and Exchanges: We offer a 30-day return policy for most items. If you are not completely satisfied with your purchase, you may return it within 30 days of receipt for a refund or exchange. Items must be unused, in their original packaging, and accompanied by proof of purchase. Return shipping costs are the responsibility of the customer, unless the item was damaged or defective upon arrival.
1. What is the main purpose of the Multi-layer Formic Acid Vacuum Soldering Reflow Oven?

The main purpose of the Multi-layer Formic Acid Vacuum Soldering Reflow Oven is to provide high precision and efficiency in chip soldering, specifically for semiconductor packaging.

2. What are the dimensions of the reflow oven?

The dimensions of the Multi-layer Formic Acid Vacuum Soldering Reflow Oven are 1400mm x 900mm x 2150mm.

3. What voltage does the soldering oven operate on?

The soldering oven operates on a voltage of 380V.

4. What is the weight of the oven?

The Multi-layer Formic Acid Vacuum Soldering Reflow Oven weighs 550 KG.

5. What is the temperature range that this reflow oven can achieve?

The temperature range of the reflow oven is from room temperature to 400℃.

6. How many layers does the soldering oven have?

The Multi-layer Formic Acid Vacuum Soldering Reflow Oven features a 3-layer design.

7. What gases are used in this soldering system?

The oven utilizes nitrogen and formic acid for improved solder quality during the soldering process.

8. What is the cooling speed of the oven?

The platform cooling speed of the oven is between 100-120℃ per minute.

9. How precise is the temperature control in this reflow oven?

The temperature control in the Multi-layer Formic Acid Vacuum Soldering Reflow Oven is precise within ±1%.

10. What are the applications of this reflow oven?

The oven is used for semiconductor packaging, chip soldering in manufacturing processes, high-precision soldering in labs, research and development, and repair and maintenance of electronic products.

11. What is the heating speed of the oven?

The platform heating speed of the oven is 35-40℃ per minute.

12. Is the oven suitable for laboratories?

Yes, the Multi-layer Formic Acid Vacuum Soldering Reflow Oven is suitable for high-precision soldering in laboratories and production lines.

13. How is the oven packaged for shipping?

The oven is packaged in a standard export wooden box to ensure safe delivery.

14. What is the supply ability of this product?

The supply ability of the Multi-layer Formic Acid Vacuum Soldering Reflow Oven is 10 pieces per month.

15. Is the oven new or refurbished?

The Multi-layer Formic Acid Vacuum Soldering Reflow Oven is brand new.

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