High Quality and High Capacity Biscuit Machine Hollow Wafer Machine

Material and Parameters:

Baking Framework: Grey cast iron

Baking Plate: Special heat-resistant cast iron

Automatic Spring System: Adjustable based on oven and frame stretch

Gas Solenoid Valve: Italian import components

Gas Relief Pressure Valve: Imported from Japan

Baking Temperature Adjustable Range: From normal to 180°C

Baking Plate Size: 470×325mm, 470×350mm, 500×350mm

Sheet Thickness Adjustment: 2.5mm~5.0mm (adjustable)

Wafer Output: 50 grams~60 grams (adjustable)

Oven Frame Structure: GB steel

Oven Sheet Metal & Smoke Exhaust Chimney: 304 stainless steel

Guiding Rail: 45# cold drawn steel

Thermal Insulation Material: Silicon insulation board

Electric Components:

10.4-inch Colorful Touch Screen: Mitsubishi

PLC: Mitsubishi

Electric Motor: SEW

Bearing: SKF

Cylinder: Festo

Switches: Schneider

Frequency Converter: Danfoss

Proximity Switch: OMRON

Product Details:

Our Full-Automatic Wafer Production Line is designed to meet the needs of the domestic biscuit manufacturing industry, while incorporating best practices from global wafer production lines. It boasts reliable performance, a compact structure, high yield, low energy consumption, and simple operation.

Key components include:

Baking Oven

Cooling Tower

Sheet Picking Machine

Cream Spreading Machine

Cooling Cabinet

Cutting Machine

Batter Mixer

Cream Mixer

Smash Machine

The system uses SEW Germany-driven motors and SKF France bearings. The PLC programming ensures that the process is fully automated and easy to control, significantly enhancing production efficiency.

High Quality and High Capacity Biscuit Machine Hollow Wafer Machine:

We specialize in producing superior quality Chocolate Coating Hollow Wafer Machines. These machines enrobe wafers in a crispy chocolate layer, with a smooth and soft chocolate filling inside—perfect for creating a sweet, delightful experience.

Our production line is designed for stable performance and reliable results. With SEW motors, SKF bearings, and an automated PLC system, this equipment is easy to operate and highly efficient.

Complete Line Parameters:

Capacity: 10.0 tons (24 hours)

Power Supply Requirement: 380V, 50HZ

Motor Power: 63.0KW

Production Demoulding Rate: ≥98%

LPG Consumption: 23kg/h

Natural Gas Consumption: 20-30 m³/h

Baking Time/Baking Speed: 90 seconds

Baking Plate Size: 470×325mm

Complete Line Dimensions (L×W×H): 46.5m×5.0m×2.5m

Gross Weight of Hollow Wafer Machine: 20 tons

Chocolate Enrobing Wafer Ball Machine:

Our line also includes equipment for producing chocolate-coated wafer balls, ensuring that your production capabilities meet every demand in wafer and chocolate coating.