The 2500w Mini Desktop Reflow Oven is a compact rework station for soldering mounted PCBs and reworking SMD/BGA components using combined infrared and hot air heating.
Rated power: 2500W (peak). Voltage: AC 220V. Current: 11.4A. Overall dimensions: 420 × 405 × 265 mm. Net weight: 20 kg. Package size: 52 × 51 × 38 cm. Gross weight: 25 kg.
Soldering area is 270 × 270 mm. Rated capacity is listed at 300 × 300 mm, so it is best suited for small to medium PCBs, prototyping, and repair work.
The unit uses a combination of infrared radiation and hot air heating to provide even, efficient heat distribution for reflowing solder.
Yes. It is designed for both leaded and lead-free soldering processes.
Yes. The oven is intended for reworking surface-mount devices including BGA components, offering precise and even heating for delicate packages.
Place the PCB centrally on the soldering area, use appropriate temperature/time profiles (follow solder paste and component manufacturer recommendations), ensure good ventilation or fume extraction, and allow the unit to cool before handling. Always follow the user manual and local electrical safety rules.
Video technical support is available. For detailed assistance, check the seller’s support channels or included documentation.
Specific warranty terms are not listed in the product description. Contact the seller or distributor to confirm warranty length and after-sales service details.
Regular maintenance includes keeping the heating elements and chamber free of excess flux and debris, checking airflow paths, and allowing the oven to cool before cleaning. Follow the user manual for recommended maintenance intervals.
Yes. Reflowing solder can produce fumes. Use the oven in a well-ventilated area and, where possible, employ a fume extractor or local ventilation to protect health and prevent residue buildup.
This is a mini desktop reflow oven designed primarily for prototyping, repair, small batches, and educational use. It is not optimized for high-volume continuous production.
Use recommended reflow profiles for your solder paste and components, minimize exposure time at peak temperatures, consider shielding or selective heating for sensitive parts, and monitor board temperatures with thermocouples when precision is required.
Specific maximum board thickness and weight are not provided. Given the desktop design and 270 × 270 mm soldering area, the oven is intended for typical PCB assemblies used in prototyping and repair rather than very thick or heavy boards.
Stop using the oven, disconnect power, and contact the seller or technical support. Use the provided video technical support resources and consult the user manual for troubleshooting steps.
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